Equipment

United Technology provides a state of the art Wafer/Glass Photo Resist Process Tool called as a Track system.

MSX 1000 | MSX 2000 |

 

MSX 1000

  • Coater/Developer for Wafer and Glass substrate
  • Application: Memory, Mems, Bump, LED, LCD process
  • Dimension: 1550 (W) x 1270 (D) x 1800 (H) (mm)
  • Substrate size:
    • Wafer: Max 8"
    • Glass: Max 150mm x 150mm
  • Substrate size Auto conversion
    • 2"-4", 4"-6", 6"-8"


Configuration

Option Coater Developer
- AD(adhesion) bake. - CCSS or LCSS system
- RRC & PR pump share function(2nozzle/1pump) - Swing dispens, VCD for glass process
Common
- THC / TCU / FFU / Bar-cod / VCD & Aligner(Glass sub.) / Add Bake unit (3set) / Spin unit Max. 4set
Utility Spec Power Power Phase Ampare Conn. Type
AC220 φ1 50A
Pressure Usage Fitting Tupe AIR Tube
Air(CDA) 5Kgf/cm2 150L/min Swg 3/8" SUS or PFA
Vacuum ≥ 600mmHg 100L Swg 3/8" SUS or PFA
N2 1.5Kgf /cm2 100L/min Swg 3/8" SUS or PFA
DI Water 1.5Kgf /cm2 3L/min Swg 3/8" SUS or PFA
PCW 1.5Kgf /cm2 20L/min Swg 3/8" SUS or PFA
Exhaust Exh. volume Type Duct Size Duct Material
2.8m3 Heat Φ 100X2ea AL or SUS
2.8 m3 Alkali Φ 100X2ea PVC
2.8 m3 Organic Φ 100X2ea AL or SUS
Uniformity Process Test 2 inch Sapphire wafer (Coating)
Uniformity (%) (Max-min)/(Max+min) x 100
Coating Spec. Within a wafer ≤ 3.0 %
Wafer to wafer ≤ 3.0 %
Raw data Max(average data) 20480 A
min(average data) 20132 A
Uniformity Wafer to wafer 0.63%
 

MSX 2000

  • Coater/Developer for Wafer and Glass substrate
  • Application: Memory, Mems, Bump, LED, LCD process
  • Dimension: 2530 (W) x 1350 (D) x 1900 (H) (mm)
  • Substrate size:
    • Wafer: Max 8"
    • Glass: Max 150mm x 150mm, 200mm x 200mm
  • High Throughput
  • Various Application


Configuration

Configuration + 5-spin(2" / 4" / 6") or 4-spin(8" / 12")
+ 4-AD & 8-HP & 4-CP & Add 4set(option)   → 4-Spin, Bake : Max. 20set
+ 6-AD & 12-HP & 6-CP   → 5-spin, Bake : Max. 24set
+ Option : TCU / THC / FFU / WEE Unit
Utility Spec Power Power Phase Ampare Conn. Type
AC220 φ1 80A
Pressure Usage Fitting Tupe AIR Tube
Air(CDA) 5Kgf /cm2 150L/min Swg 3/8" SUS or PFA
Vacuum ≥ 600mmHg 100L Swg 3/8" SUS or PFA
N2 1.5Kgf /cm2 100L/min Swg 3/8" SUS or PFA
DI Water 1.5Kgf /cm2 5L/min Swg 3/8" SUS or PFA
PCW 1.5Kgf /cm2 20L/min Swg 3/8" SUS or PFA
Exhaust Exh. volume Type Duct Size Duct Material
2.8 m3 Heat φ100X2ea AL or SUS
2.8 m3 Alkali φ100X1ea PVC
2.8 m3 Organic φ100X2ea AL or SUS
Uniformity Process Test 8 inch Silicon wafer (Coating)
Uniformity (%) (Max-min)/(Max+min) x 100
Coating Spec. Within a wafer ≤ 2%
Wafer to wafer ≤ 2%
Raw data Max(average data) 9502 A
min(average data) 9459 A
Uniformity Wafer to wafer 0.23%